IBM BLADE SERVER HS23 PDF

Two PowerXCell 8i processors at 3. It ran the Sun Solaris operating system from Sun Microsystems. It also provides outside connectivity via an Infiniband 4x DDR adapter. This makes a total width of four slots for a single TriBlade. To use the other switch module bays, a daughtercard needs to be installed on each blade that needs it, to provide the required SAN , Ethernet, InfiniBand or Myrinet function.

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Standard 30 mm single-wide form-factor protects your investments by providing compatibility with the BladeCenter H, E, S, and HT chassis. Withdrawn from marketing: The HS23 models covered in this product guide are now withdrawn from marketing.

Suggested use: versatile platform to run a broad range of workloads, including infrastructure, virtualization, and enterprise applications. Figure 1. Key features The BladeCenter HS23 gives you the networking capacity that you need to manage your data center. Some configurations might have restrictions. See Table 4 for compatibility details.

Scalability and performance The BladeCenter HS23 , E v2 offers numerous features to boost performance, improve scalability, and reduce costs: The Intel Xeon processor E v2 product family improves productivity by offering superior system performance with up to core processors up to 2.

Up to two processors, 24 cores, and 48 threads maximize the concurrent execution of multi-threaded applications. Intelligent and adaptive system performance with Intel Turbo Boost Technology 2.

Intel Hyper-Threading Technology boosts performance for multi-threaded applications by enabling simultaneous multi-threading within each processor core, up to two threads per core. Intel Virtualization Technology integrates hardware-level virtualization hooks that allow operating system vendors to better utilize the hardware for virtualization workloads.

See Table 6 for details. Availability and serviceability The BladeCenter HS23 provides many features to simplify serviceability and increase system uptime: Dual independent power and signal connectors to the BladeCenter chassis midplane provide fault tolerance to increase uptime. The HS23 offers Chipkill, memory mirroring, and memory rank sparing for redundancy in the event of a non-correctable memory failure. Tool-less cover removal provides easy access to upgrades and serviceable parts, such as CPU, memory, and adapter cards.

The server offers hot-swap drives supporting integrated RAID 1 redundancy for data protection and greater system uptime. The power source independent light path diagnostics panel and individual light path LEDs quickly lead the technician to failed or failing components. This simplifies servicing, speeds up problem resolution, and helps improve system availability.

The Predictive Failure Analysis PFA detects when system components processors, memory, and hard disk drives operate outside of standard thresholds and generates pro-active alerts in advance of possible failure, therefore increasing uptime. Built-in Integrated Management Module II IMM2 continuously monitors system parameters, triggers alerts, and performs recovering actions in case of failures to minimize downtime.

Three-year customer replaceable unit and onsite limited warranty, next business day 9x5. Optional service upgrades are available. Integrated industry-standard Unified Extensible Firmware Interface UEFI enables improved setup, configuration, and updates, and simplifies error handling.

FastSetup simplifies, automates, and speeds up the deployment process from server power-up to production, making BladeCenter easier to manage, deploy, and maintain. Systems Director provides proactive systems management with comprehensive management tools that help to increase up-time, reduce costs, and improve productivity through advanced server management capabilities.

Energy efficiency The HS23 offers the following energy-efficiency features to save energy, reduce operational costs, increase energy availability, and contribute to the green environment: Component-sharing design of the BladeCenter chassis provides ultimate power and cooling savings. The Intel Xeon processor E v2 product family offers significantly better performance over the previous generation while fitting into the same thermal design power TDP limits.

Intel Intelligent Power Capability powers individual processor elements on and off as needed, to reduce power draw. Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally constrained data centers and telecommunication environments.

Low-voltage 1. Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow through the system. Figure 2. Figure 3. Figure 4. Table 1.

System specifications.

ALEKSANDER BRUCKNER SOWNIK ETYMOLOGICZNY PDF

BladeCenter HS23

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ETEROTOPIE FOUCAULT PDF

Fix Central

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